Bismuth Telluride Revolutionizes Thermal management Chips

Zegen Advanced Materials, a pioneer in advanced thermal management solutions, announces a groundbreaking advancement in microsystem temperature control technology utilizing single-crystal bismuth telluride. This innovation positions the company at the forefront of precision thermal regulation for next-generation electronic systems.

Superior Performance in Miniaturized Thermal Control

The newly developed bismuth telluride-based microsystem chips leverage the unique properties of single-crystal thermoelectric materials to achieve unprecedented temeprature stability in compact configurations. With ZT values exceeding 1.5 at room temperature, these chips demonstrate 30% higher thermoelectric conversion efficiency compared to conventional polycrystalline alternatives.

“Our single-crystal bismuth fabrication technology solves critical challenges in microscale thermal management, This advancedment enables ±0.1℃ temperature control accuracy in packages smaller than 10mm2-essential for high-density electronics colling. “

Key applications Driving Industry Transformation

1.Wearable Medical Devices: Enables precise temperature maintenance for biosensors

2.5G/6G Communication Systems: Prevents thermal throttling in millimeter-wave ICs

3.AI Accelerator Chips: Maintains optimal junction temperatures for machine learning processors

4.Automotive Electronics: Ensures reliability of ADAS systems under extreme conditions

Sustainable Thermal Management Solutions

This bismuth telluride thermoelectric chips consume 40% less power than conventional Peltier devices while achieving superior heat flux density (up to 50W/cm2). This energy-efficient thermal regulation technology aligns with global initiatives for greener electronics manufacturing.

Technical Advantages:

  • Crystal orientation control enhances carrier mobility (>320cm2/Vs)
  • Ultra-low thermal conductivity (1.2W/m.K at 300K)
  • Excellent mechanical stability for wafer-level integration
  • Compatible with standard MEMS fabrication processes

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