CHANGSHA ZEGEN ADVANCED MATERIALS LIMITED

Sputtering targets are an essential component in the process of thin film deposition. They play a cruicial role in various industries, including electronics, semiconductors, displays and optics. Sputtering target materials are usually high-purity metals, alloys, or compounds that are used as the source of material in sputtering deposition. When a high-energy ion beam or plasma hits the target, atoms or molecules are ejected and deposited onto a substrate to form a thin fiml.

There are several types of sputtering target materials available, depending on the application requirements. Common materials include metals (such as aluminum, copper, titanium), alloys (such as stainless steel, nickel alloy), and compounds( such as oxides, nitrides, and carbides.)

High purity is a critical characteristic of sputtering target materials, as it ensures the quality and performance of the resulting thin films. Other important feactures include uniform composition, good crystallinity and mechanical stability.

Sputtering target materials find wide applications in numerous fields. In electronics, they are used in the fabrication of semiconductor devices, magnetic storage media and optical coatings. In display, they are employed in the production of thin film transistors(TFTs) for liquid crystal displays(LCDs). Additionally, they are utillized in solar cells, coatings and decorative coatings.

The sputtering process involves generating a plasma or ion beam, which bombards the target material. The ejected atoms or molecules then deposit onto the substrate to form the thin film. Sputtering equipment typically consists of a vacuum chamber, a power source, a target holder and a substrate stage.

Sputtering offers several advantages, including controlled film thickness, good adhesion and the ability to deposit complex compositions. It allows for the deposition of high-quality thin film with precise control over the properties of the deposited material.

To ensure the quality of sputtering target materials, strict quality control measures are implemented, Shape, and size of the target to achieve desired thin film properties.

Sputtering target materials are essential in the fabrication of thin films with controlled properties. Their high purity and customizable nature make them suitable for a wide range of applications.

Metal Sputtering Targets

Minor Metals

Zirconium	Hafnium	Vanadium	Cadmium	Chromium	Indium	Bismuth	Antimony
Germanium	Tellurium	Tantalum	Niobium	Tungsten	Copper	Aluminum	Molybdenum
Nickel	Cobalt	Iron

Rare Earths

Scandium	Yttrium	Lutetium	Ytterbium	Thulium	Erbium	Holmium	Dysprosium
Terbium	Gadolinium	Europium	Samarium	Lanthanum	Neodymium	Praseodymium

Precious Metals

Rhenium

Ruthenium

Rhodium

Osmium

Iridium

Silver

Gold

Alloy Sputtering Targets

Metal Compound Sputtering Targets